Winbond W25Q128FVSIG Winbond W25Q128FVSIG Winbond W25Q128FVSIG

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w25q128fvsig 1.12 3.813


Manufacturer Part Number: W25Q128FVSIG
Pbfree Code: Yes
Part Life Cycle Code: Obsolete
Part Package Code: SOIC
Package Description: SOP, SOP8,.3
Pin Count: 8
ECCN Code: 3A991.B.1.A
HTS Code: 8542.32.00.51
Manufacturer: Winbond Electronics Corp
Risk Rank: 7.92
Clock Frequency-Max (fCLK): 104 MHz
Data Retention Time-Min: 20
Endurance: 100000 Write/Erase Cycles
JESD-30 Code: S-PDSO-G8
JESD-609 Code: e3
Length: 5.28 mm
Memory Density: 134217728 bit
Memory IC Type: FLASH
Memory Width: 1
Number of Functions: 1
Number of Terminals: 8
Number of Words: 134217728 words
Number of Words Code: 128000000
Operating Mode: SYNCHRONOUS
Operating Temperature-Max: 85 °C
Operating Temperature-Min: -40 °C
Organization: 128MX1
Package Body Material: PLASTIC/EPOXY
Package Code: SOP
Package Equivalence Code: SOP8,.3
Package Shape: SQUARE
Package Style: SMALL OUTLINE
Parallel/Serial: SERIAL
Peak Reflow Temperature (Cel): NOT SPECIFIED
Power Supplies: 3/3.3 V
Programming Voltage: 3 V
Qualification Status: Not Qualified
Seated Height-Max: 2.16 mm
Serial Bus Type: SPI
Standby Current-Max: 0.00002 A
Subcategory: Flash Memories
Supply Current-Max: 0.02 mA
Supply Voltage-Max (Vsup): 3.6 V
Supply Voltage-Min (Vsup): 2.7 V
Supply Voltage-Nom (Vsup): 3 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: INDUSTRIAL
Terminal Finish: Tin (Sn)
Terminal Form: GULL WING
Terminal Pitch: 1.27 mm
Terminal Position: DUAL

Flash 128MX1 PDSO8 SOIC-8